This system is suitable for laser marking of various metal or non-metal products of tridimensional curved surface, widely used in laser 3D marking of products in mobile phone manufacturing, stereo circuit, medical device, mold, 3C electronic, auto parts and electronic communication.
Features | Technical parameters | |
Mobile Mid Bezel and Frame Laser Marking System | Easy to operate, four sides of mid bezel or frame can be automatic marked at one time;
360 degree freely rotation, focus length adjust automaticly; High mechanical positioning and engraving precision; |
Lifting accuracy: 0.02mm
Rotating accuracy: 0.05mm Rotating degree: 360° |
3-axises Back cover Laser Engraving System | Four sides and back face of phone case back cover can be automatic marked at one time;
High engraving efficiency; High mechanical positioning and engraving precision; |
Repeating accuracy: 0.02mm
Lifting accuracy: 0.02mm Clamp size: 164*80mm Rotating accuracy: 0.05mm Rotating degree: 360° |
Sim card Laser Engraving System | Specially designed for sim card three sides automatic marking;
Suitable for materials with multiple sides; High engraving precision and efficiency; |
Repeating accuracy: 0.02mm
Lifting accuracy: 0.02mm Z-axis adjusting height: 200mm |
Laser power: 10W/30W/50W
Laser wavelength:1064nm
Q-switch frequency:20KHZ-100KHZ
Marking field: 100mm*100mm/175mm*175mm
Minimum character: 0.1mm
Marking speed : 0~7000m/s
Lifting accuracy: 0.02mm
Rotating accuracy: 0.05mm
Rotating degree: 360°
Input power : AC 220V±22V 50Hz/60Hz 10A
Power of machine : ≤500W
Machine size: 900*650*1400mm